By Lisa Wang / Staff reporter
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Silicon photonics would play a dominant role next year and make chip-level co-packaged optics (CPO) packaging possible, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. “For years, critics questioned the reliability of CPO. The doubts are being thoroughly dismantled by real-world data and market validation,” TSMC vice president K.C. Hsu (徐國晉) said at a SEMI forum in Taipei. The company is on track to enter production of CPO later this year, Hsu said in another forum arranged by Imec in Taipei yesterday, about four months after TSMC announced its progress in CPO development in May.
Taiwan Semiconductor Manufacturing Co vice president of advanced packaging technology development K.C. Hsu speaks at a technology forum in Taipei yesterday
Imec is the world’s leading independent research and innovation hub in nanoelectronics and digital technologies. As server racks and data centers are expanding to handle massive artificial intelligence (AI) workloads, networks are being pushed to their limits, and that has stimulated demand for optics, the “nerve system” of data centers, Hsu said.
