EXPANDING:
Firms are accelerating commercialization of the technologies as the industry moves beyond chip-level speeds to upgrading rack-to-rack links, SEMI said
Silicon photonics and copackaged optics (CPO), technologies seen as critical to meeting the surging bandwidth demands of artificial intelligence (AI) infrastructure, would be among the main themes at the Semicon Taiwan trade show, which opens on Wednesday, event organizer SEMI said yesterday.The forum runs until Friday at the Taipei Nangang Exhibition Center, with technical forums beginning today.The event is expected to set a record in terms of the number of participants, SEMI said, projecting more than 1,300 exhibitors from 65 countries across 4,300 booths and more than 100,000 attendees.
SEMI Taiwan president Terry Tsao, center, and other guests pose for a photograph at a news conference in Taipei on July 22.
Optical interconnects underpinning AI infrastructure would be one of the highlights, with contract chipmaker Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) compact universal photonics engine (COUPE) platform and the industry’s progress toward mass CPO production expected to draw attention, it said.With AI chips, high-performance computing processors and high-bandwidth memory (HBM) demanding faster data transmission, conventional electrical interconnects are increasingly giving way to optical communications to boost AI data center efficiency, SEMI said.
