Nvidia Corp (NASDAQ:NVDA) is reportedly accelerating development of its next-generation Feynman AI platform, pushing Taiwan Semiconductor Manufacturing Co.
(NYSE:TSM) to fast-track advanced chipmaking and packaging capacity ahead of its expected 2028 launch.
Nvidia Pushes Feynman Development Nvidia is shifting research and supply chain resources toward Feynman even as its Vera Rubin platform enters mass production and ramp-up, Digitimes reported on Friday.
Feynman is expected to feature 3D chiplets, TSMC’s System on Integrated Chips (SoIC) technology, high-bandwidth memory (HBM) and co-packaged optics (CPO), representing a major architectural evolution from Rubin.
Industry sources expect Feynman to use TSMC’s upgraded 2nm-class A16 process.
