AI servers are pushing GPU power densities beyond the limits of conventional cooling, increasing thermal resistance, energy consumption, and the need for colder facility water.
As next-generation chips continue to scale, data center operators require new approaches that can deliver greater cooling performance without compromising efficiency.
This Accelsius whitepaper explores a direct-on-die two-phase cooling approach designed to reduce thermal resistance, improve heat transfer, and support higher facility water temperatures.
Read now to discover:
How direct-on-die two-phase cooling reduces thermal resistance by eliminating traditional cold plates and thermal interface materials
