RUNNING HOT:
The contract chipmaker is planning to both deepen and broaden its capacity, with more facility space and more advanced chips on offer
By Lisa Wang / Staff Reporter
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United Microelectronics Corp (UMC, 聯電), the world’s fourth-largest contract chipmaker, plans to invest US$5 billion over the next two to three years to expand silicon photonics and advanced packaging capacity as artificial intelligence (AI)-driven demand accelerates.The company views silicon photonics and advanced packaging as vital businesses to its growth, and expects AI-related revenue to reach about US$300 million this year and surpass US$1 billion in three years, it said yesterday.“We actually feel pretty optimistic about advanced packaging, and that’s why we started facility deployment,” UMC CEO Jason Wang (王石) said at an earnings conference. “The overall [advanced packaging] addressable market is projected to more than double by 2030.”
