Debuted at the World Artificial Intelligence Conference, the near-packaged optics solution offers a commercially viable path past the 128-chip cap of legacy wiring systems
00:00/00:00
您的浏览器不支持 audio 标签。
Listen to this article
1x
Hong Kong-listed chipmaker Shanghai Biren Intelligent Technology Co. has unveiled a next-generation architecture capable of interconnecting up to 1,024 graphics processing units (GPUs), adopting advanced optical connections to power massive artificial intelligence workloads.
The firm uses near-packaged optics to bypass traditional architecture limits and scale more than 1,000 processor cards across a…
The company says 60 per cent of the fresh capital will be for commercialisation and mass production of next generation…
‘Optical computing … can meet AI’s ever-growing computational demands and unleash a wave of new applications’: Professor Xie Peng.
Peking University researchers develop new all-optical interconnect system linking standard electronic chips with specific…
Jensen can't risk semiconductor supply chains derailing the AI hype train
Iluvatar CoreX aims for its AI chip architecture to outperform the U.S. chip powerhouse’s most advanced product by 2027 as demand…
