Nvidia shouted proudly in a recent blog post that its network of American manufacturing partners and suppliers now spans 43 states, that TSMC's Phoenix plant is producing Blackwell wafers at volume, and that it plans to produce up to $500 billion of AI infrastructure in the U.S. over four years with partners including TSMC, Foxconn, Wistron, Corning, Coherent, and Amkor. Intel has made its own case in an America 250 post presenting end-to-end U.S. capabilities across design, manufacturing, and advanced packaging.Both accounts hold up at the wafer stage but omit the same downstream step: every Blackwell die that leaves TSMC's Arizona fab still crosses the Pacific to be packaged, no HBM is manufactured or packaged on U.S. soil, and the facilities intended to close those gaps won’t start production until 2028 at the earliest.
Nvidia and Intel tout homegrown American chip supply chain prowess as country bolsters local production, but gaps remain — crucial Blackwell packaging steps remain offshore as projects grow in scope and scale
America's AI supply chain now starts and ends in the U.S.
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