Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys' 3D electromagnetic field analysis tool Ansys HFSS™ and thermal analysis tool Ansys Icepak®, and marks a significant step toward streamlining the simulation workflow for electronic circuit designers. Murata is also the first company to offer passive component simulation models via Ansys Icepak*.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260615241645/en/ [Murata Manufacturing Co., Ltd.] New collaboration with Synopsys
As demand for high-speed, high-capacity communications continues to grow, electronic circuit design has become increasingly complex. Engineers must now account for a range of physical phenomena, from electromagnetic interference (EMI) to component heat generation, within a single design. Addressing these challenges early in the design process is critical; overlooking them can trigger costly redesigns, extend development timelines, and drive up prototyping expenses. This has placed greater pressure on electronic component suppliers to provide ready-to-use, high-quality simulation models that are compatible with the tools engineers already rely on.
