Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions
PR Newswire
SUNNYVALE, Calif., June 17, 2026
Market Leaders Including Cisco, MediaTek, NVIDIA, and Samsung FoundryDemonstrate Measurable Impact, Advancing the Shift from Overdesign to Co-design Key Highlights Integrates golden signoff multiphysics analysis directly into timing signoff, design closure, multi-die, and analog workflows, enabling earlier, more accurate design decisionsEnables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimesDelivers up to 10x faster design closure with higher ECO success rates and improved PPAProvides concurrent power integrity, electromagnetic, and thermal analysis across dies and packaging, enabling early system-level insights from exploration to signoffSUNNYVALE, Calif., June 17, 2026 /PRNewswire/ -- Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics are becoming critical constraints at advanced nodes and in multi-die architectures, requiring a unified EDA and multiphysics approach. The Multiphysics Fusion portfolio combines Synopsys' AI-powered EDA solutions with Ansys golden signoff analysis across timing signoff, design closure, multi-die design, and analog workflows. Validated by market leaders, these solutions improve predictability and accelerate convergence for AI and high-performance computing systems.
