Broadcom launched a $35 billion AI infrastructure platform with Apollo Global Management and Blackstone, creating a private credit backed vehicle to finance one of the largest compute buildouts in the AI industry.
The AI XPV Platform will use Broadcom’s custom XPUs and networking technology to support large scale deployments for leading AI labs. The group is targeting more than 20 gigawatts of compute capacity by 2028, a figure that shows how aggressively AI companies are racing to secure power, chips, and data center access.
The first tranche will support Anthropic’s expansion to more than 1 gigawatt of compute capacity at Fluidstack sites, with deployment expected to begin in mid 2026. Apollo is leading the financing, with Blackstone’s credit and insurance unit also backing the platform.
The deal builds on Broadcom’s existing relationship with Anthropic and Google. In April, Broadcom signed a long term agreement with Google to co develop and supply custom AI chips through 2031, while Anthropic secured access to about 3.5 gigawatts of Google TPU capacity beginning in 2027.
For Broadcom, the platform pushes the company beyond the role of chip supplier. It is pairing hardware with financing, giving AI labs a way to scale capacity without carrying the full upfront cost of infrastructure on their own balance sheets.
