Nvidia and SK Hynix have locked in a multi-year agreement to co-develop next-generation memory chips purpose-built for AI workloads. The deal, announced on June 7 following a meeting between Nvidia CEO Jensen Huang and SK Group Chairman Chey Tae-won in Seoul, centers on HBM4, the latest iteration of high-bandwidth memory that will power Nvidia’s upcoming Vera Rubin accelerator platform.
This isn’t just a supply agreement. It’s a full design-and-manufacturing collaboration that spans chip architecture, infrastructure buildout, and product diversification across personal AI and robotics applications. Initial deliveries are slated for Q3 2026.
What the deal actually covers
The partnership positions SK Hynix as Nvidia’s largest memory partner. The collaboration covers components for several Nvidia product lines: the Vera Rubin accelerator, Vera CPUs, RTX Spark PCs, and Jetson Thor robotics systems, spanning data center AI, consumer computing, and physical AI.
SK Hynix has also signaled plans to double its wafer production capacity over the next five years.
