SK Group Chairman Chey Tae-won, left, and Nvidia CEO Jensen Huang participate in a press briefing held at SK Group's headquarters in Seoul, Friday. Yonhap
SK hynix has ordered new high-bandwidth memory (HBM) production equipment from Hanmi Semiconductor in a deal worth 44.2 billion won ($28.7 million), a regulatory filing showed Monday, in a possible bid to expand production of HBM4 products for U.S. chip giant Nvidia.
Hanmi Semiconductor said in a regulatory filing it has won the deal to supply thermo-compression (TC) bonders to SK hynix through early September.
A TC bonder, considered core equipment in HBM production, is used to stack multiple dynamic random access memory (DRAM) chips to produce HBM.
With a single TC bonder typically priced at around 3 billion won, industry watchers said the agreement likely covers 15 units.
