Foxconn and Intel have announced they will be partnering on the development of next-generation AI infrastructure and intelligent compute platforms.
In a statement announcing the collaboration, Foxconn (also known as Hon Hai Technology Group) said it would be combining Intel’s semiconductor technology with its own manufacturing, system integration, and data center deployment capabilities to “accelerate the large-scale deployment of AI-driven technologies across Edge and physical AI applications.”
No financial terms or timeline for the partnership have been detailed, but the partners said the collaboration efforts would span silicon, rack, system, and application layers.
Young Liu and Lip-Bu Tan – Foxconn
At the rack level, the collaboration will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks, AI accelerator architectures, high-speed interconnects, and liquid cooling designs.
