Amtech Systems Announces Pricing of $60 Million Oversubscribed Offering of Common Stock

Amtech Systems Announces Pricing of $60 Million Oversubscribed Offering of Common Stock

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, today announced the pricing of its oversubscribed underwritten public offering of 2,926,829 shares of its common stock, at a public offering price of $20.50 per share, for total gross proceeds of approximately $60 million, before deducting underwriting discounts, commissions, and offering expenses. The offering is expected to close on or about June 3, 2026, subject to customary closing conditions.

The Company intends to use the net proceeds from the offering to accelerate growth across its semiconductor packaging and advanced wafer substrate fabrication platforms, accretive merger and acquisition opportunities, working capital and general corporate purposes.

Titan Partners, a division of American Capital Partners, is acting as the sole bookrunner for the offering.

The offering is being made pursuant to a shelf registration statement on Form S-3 (File No. 333-294296) filed with the Securities and Exchange Commission (“SEC”) on March 13, 2026, and declared effective by the SEC on March 23, 2026. A preliminary prospectus supplement and accompanying prospectus relating to the offering will be available on the SEC’s website at www.sec.gov. Copies of the preliminary prospectus supplement and accompanying prospectus relating to the offering, when available, may also be obtained by contacting Titan Partners Group LLC, a division of American Capital Partners, LLC, 4 World Trade Center, 49th Floor, New York, NY 10007, by phone at (929) 833-1246 or by email at prospectus@titanpartnersgrp.com.