Samsung Electronics will invest 39 trillion dong, or about $1.5bn, in a semiconductor testing plant in Vietnam, according to a document seen by Reuters on Wednesday. Construction has already begun in an industrial park 60 kilometres north of Hanoi, with operations scheduled to start in November 2027.
The plant will be Samsung’s first dedicated chip-testing facility in Vietnam.
The numbers attached to the project are larger than the headline. The facility is sized to deliver 153.3 billion gigabits a year of DRAM and a further 255.6 billion gigabits of NAND.
Samsung has also indicated it intends to reinvest profits from the project, “if any,” up to a further $2.5bn for a potential second facility, bringing the total committed and contingent footprint to roughly $4bn. Vietnamese authorities approved the first phase in March; the contingent expansion remains subject to project performance.
Testing, in chip-industry terms, sits between wafer fabrication and final assembly. It is the step at which every memory die produced upstream is verified, binned by performance and prepared for packaging.
