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Besi orders more than double as AI and hybrid bonding tech drive demand

July 23 : BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data centres.Investors are betting on rising demand for Besi's hybrid bonding solutions, a chip-packaging technology that ena

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channelnewsasia.comStai leggendo5 g fa

Besi orders more than double as AI and hybrid bonding tech drive demand

Besi Q2 bookings doubled to €292.9M from €128M YoY, fuelled by AI and hybrid bonding; customers rose to 21 from 15. Multi-year AI infrastructure spending makes hybrid bonding mission-critical for data centres, reshaping capex priorities and vendor strategy.

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economictimes.indiatimes.com4 g fa

Besi orders more than double as AI and hybrid bonding tech drive demand - The Economic Times

Besi's quarterly orders more than doubled, fueled by AI and hybrid bonding technology. The company saw increased customer adoption of its advanced chip packaging solutions. Demand for AI applications continues to…

Timeline cronologica

giovedì 23 luglio 2026·channelnewsasia.com
Besi orders more than double as AI and hybrid bonding tech drive demand
July 23 : BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding,…
giovedì 23 luglio 2026·economictimes.indiatimes.com
Besi orders more than double as AI and hybrid bonding tech drive demand - The Economic Times
Besi's quarterly orders more than doubled, fueled by AI and hybrid bonding technology. The company saw increased customer adoption of its advanced chip packaging solutions. …