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Storia in 2 fonti

As US adds more semiconductor hurdles, Chinese firms could seize an opportunity

Washington’s latest move marks another development in the ever-intensifying tech race between the rival superpowers.

Raccontata dascmp.comcnbc.com

Confronto fonti

2 prospettive sulla stessa storia
AI · summaries
scmp.comStai leggendo10 mesi fa

As US adds more semiconductor hurdles, Chinese firms could seize an opportunity

Washington’s latest move marks another development in the ever-intensifying tech race between the rival superpowers.

originale
cnbc.com10 mesi fa

The U.S. makes it harder for TSMC, SK Hynix and Samsung to produce chips in China

TSMC, along with SK Hynix and Samsung Electronics, are losing waivers that allowed them export chipmaking equipment to manufacturing plants in China.

Leggi questa versione → originale

Timeline cronologica

  1. venerdì 29 agosto 2025·scmp.com

    US makes it harder for Samsung, Intel to produce chips in China

    The companies will now need to obtain licences to buy equipment for China, affecting sales and potentially aiding Chinese manufacturers.

  2. lunedì 1 settembre 2025·scmp.com

    As US adds more semiconductor hurdles, Chinese firms could seize an opportunity

    Washington’s latest move marks another development in the ever-intensifying tech race between the rival superpowers.

  • mercoledì 3 settembre 2025·cnbc.com

    The U.S. makes it harder for TSMC, SK Hynix and Samsung to produce chips in China

    TSMC, along with SK Hynix and Samsung Electronics, are losing waivers that allowed them export chipmaking equipment to manufacturing plants in China.