Electronics and connectivity firm Molex has invested in liquid cooling vendor CAEPlus.
CAEPlus is an early-stage company developing a liquid cooling solution, known as BoundaryCool, designed to meet the needs of AI and High-Performance Computing (HPC) data centers.
The investment will help Molex advance its own thermal management strategy, with CAEPlus technology becoming part of the company’s portfolio.
– Molex
“Advanced thermal management is becoming a critical enabler for the next wave of compute performance,” said Jairo Guerrero, VP and GM in Molex’s copper solutions business.
