By Lisa Wang / Staff reporter, in HSINCHU CITY
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Semiconductor equipment manufacturer Skytech Inc (天虹科技) on Wednesday said that it expects customer demand to be high through the second quarter of next year, particularly for equipment used in advanced chip manufacturing and packaging technologies driven by the artificial intelligence (AI) boom.The company’s new physical vapor deposition devices used in panel-level packaging (PLP) have been rapidly gaining traction, with three machines to be delivered to server customers and one to a US customer in the first quarter next year, Skytech chief executive officer George Yi (易錦良) said in Hsinchu City.“Customer validation has been exceptionally strong. We are preparing for the shipment of the fifth machine in just eight months since we began developing the equipment last year upon the establishment of new industry standards,” Yi said.
From left, Skytech Inc founder Carl Lo, chairman Paul Huang and chief executive officer George Yi pose for a photograph in Hsinchu City on Wednesday.
“It usually takes one to two years to develop new semiconductor equipment,” he added.Last year, the 310mm by 310mm panel size emerged as an industry standard for PLP technology after Taiwan Semiconductor Manufacturing Co (台積電) and ASE Technology Holding Co (日月光投控) replaced circular 300mm wafers with them.
