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In case you've not subscribed to Tom's Hardware Premium yet, here's what you've been missing out on in this week's selection of articles.First of all, we've fully redesigned Bench, our browsable database of hardware benchmarks. Using the same data that informs our massive hierarchy pages, Bench 2.0 allows you to granularly search and compare benchmarks between products. While you get an aggregated set of data in our reviews and hierarchy lists, Bench allows you much finer detail in seeing every single benchmark we run, whenever we review a new product.Bench is exclusively available for Tom's Hardware Premium subscribers.Earlier this week, we published a roadmap, focusing on the foundries that are making co-packaged optics (CPO) a reality. As the demands of data centers increase, so too do the demands on scale-up and scale-out connectivity. With AI accelerators now demanding extremely fast signalling speeds, CPO puts optical engines next to the processor or ASIC in order to shorten electrical paths, increasing data rates, shortening the electrical path, and consuming less power.We dive deep into TSMC's COUPE roadmaps, which extend to 2030, and to a blistering lane speed of 400 Gb/s, Intel's CPUs with OCI chiplets, Samsung Foundry's path to building a CPO turnkey, and GlobalFoundries' vendor-agnostic OCI-MSA CPO platform.Co-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivity
