SynopsisThe Design-linked Incentive scheme's second edition may offer significant financial support. Eligible startups and MSMEs could receive seed funding up to fifteen crore rupees. Government equity participation is also proposed alongside private investors for companies. Royalty financing and equity co-investment are options for other firms. The scheme aims to boost domestic semiconductor design capabilities and market access.The second edition of the Design-linked Incentive scheme (DLI 2.0) may offer seed funding, equity co-investment and royalty-based support to semiconductor chip design companies to boost domestic capabilities, according to the framework prepared by the Ministry of Electronics and Information Technology (MeitY).The ministry confirmed the proposed measures in a statement.Under the scheme, eligible startups and micro, small and medium enterprisesNow Playing
DLI 2.0 to widen financing options for chip design companies - The Economic Times
The Design-linked Incentive scheme's second edition may offer significant financial support. Eligible startups and MSMEs could receive seed funding up to fifteen crore rupees. Government equity participation is also proposed alongside private investors for companies. Royalty financing and equity co-investment are options for other firms. The scheme aims to boost domestic semiconductor design capabilities and market access.
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