Microsoft has enlisted 3M to supply interconnect technologies to reduce the need for cleaning connectors across its cloud and AI infrastructure.
Traditional connectors use physical contact between fibers, allowing light to travel from one fiber to another. The challenge is that such connections require frequent cleaning and inspection, as the tiniest bit of dust can disrupt interconnections.
– 3M
3M’s expanded beam optical (EBO) technology does pretty much what its name implies, increasing the beam area to overcome the effects of surface particles. The reduced sensitivity to dust means engineers can insert interconnect cables without having to worry about contamination, a benefit 3M contends will help the hyperscaler more quickly install fiber connections.
The optical interconnect can be configured and scaled from 12 to 144 fibers, supporting both rack and infrastructure applications.
