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The new Phase II site is expected to work with other facilities in the region and nation as TSMC looks to shape the future with its manufacturing

Staff writer, with CNA

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) would build three additional advanced packaging facilities in Phase II of the Chiayi Science Park (嘉義科學園區), National Science and Technology Council (NSTC) Minister Wu Cheng-wen (吳誠文) said yesterday.Speaking at the groundbreaking ceremony for the Phase II, Wu said the roughly 90-hectare site would be developed into an advanced packaging industry cluster led by TSMC.Two advanced packaging facilities at Phase I began mass production last month.

From second left, Democratic Progressive Party Legislators Wang Mei-hui, Chen Kuan-ting and Tsai Yi-yu, Chiayi County Commissioner Weng Chang-liang, National Science and Technology Council Minister Wu Cheng-wen and Taiwan Semiconductor Manufacturing Co vice president for facility construction Arthur Chuang gesture at a groundbreaking ceremony in Chiayi County yesterday.