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Rumor mill: SK Hynix is moving closer to its next step in NAND scaling, with plans to bring its 375-layer flash memory into mass production by the end of 2026. The company has already completed verification, clearing a key hurdle before volume production. The move marks progress in vertical memory design and also points to the limits of increasing layer counts.
According to sources interviewed by The Elec, mass production will take place in existing fabs, which currently produce 321-layer V9 NAND. Inside the company, the 375-layer design has been referred to as a "400-layer" product.
The difference reflects a basic problem in high-layer NAND: beyond a certain point, simply adding more layers becomes difficult with current methods. As stacks grow taller, keeping the electrical connections reliable gets harder, and companies may have to sacrifice some layers to protect yield and performance.
