For many students stepping into the job market, the first hurdle isn’t interviews; it’s the application process itself.
This was exactly the problem Agnay Srivastava and Pulkit Gupta ran into while applying for internships as engineering students at Rose-Hulman Institute of Technology.
Between tailoring resumes, writing cover letters, and filling out repetitive forms, the process became a bottleneck.
“The tools available were either not transparent about how they worked, or not affordable for students like us,” says Srivastava.
In 2025, that friction led the duo to build Tsenta, an AI-powered job application platform.
