ZutaCore raises $100M to scale waterless cooling for AI data centers
ZutaCore Ltd. announced today that it has raised $100 million in new funding to scale deployments of its waterless liquid cooling technology as AI chips push data center cooling past what air and water-based systems were built to handle.
The company sells direct-to-chip, two-phase liquid cooling that allows systems to run without water and roughly halves cooling energy use against conventional setups. Two-phase cooling moves heat by boiling a dielectric fluid directly at the chip, a method ZutaCore argues scales better than water-based systems as processor power climbs.
ZutaCore markets its core platform as HyperCool, a sealed, closed-loop system that pumps a dielectric fluid through cold plates mounted directly on top of the processors. Because the fluid is non-conductive and the loop is enclosed, a leak does not short out the electronics, a failure mode that has long made data center operators wary of running liquid near live hardware. The cold plates attach to chips from Intel Corp., Advanced Micro Devices Inc. and Nvidia Corp. and the heat is carried off as vapor to a coolant distribution unit, where it condenses and recirculates.
