AI infrastructure is pushing data center density beyond the limits traditional cooling architectures were designed to handle. As GPU racks move from 10 kW to 60–80 kW and beyond, operators face mounting pressure to support higher densities without costly, multi-year facility overhauls.
This whitepaper explores the retrofit and cooling strategies available today, from hot/cold aisle containment to direct liquid-to-chip cooling, and examines why rack-level containment represents the most complete, fastest to deploy, and most future-flexible solution for operators who cannot wait for a multi-year infrastructure overall.
Download the whitepaper to learn:
The hidden limitations and operational risks of DLC-only deployments
How operators can retrofit existing halls for high-density AI workloads
