Deals in brief: FusionAP raises pre-seed funding, SeaX Ventures backs US-based Melazyme, seven China investments, and more

FusionAP raises pre-seed funding to build advanced packaging platform

FusionAP, a Malaysia-based semiconductor packaging company, has raised USD 2 million in a pre-seed funding round co-led by Vertex Ventures Southeast Asia & India and Southern Capital Group.

Founded by former Intel and TSMC executives, FusionAP is building an outsourced semiconductor assembly and test platform focused on advanced 2.5D, 3D, and other next-generation packaging technologies. The company is led by founder and CEO Ooi Teng Chow, who previously helped build Intel’s advanced packaging operations in Malaysia, and co-founder Peter Chavart, former general manager of disaggregation manufacturing operations at Intel.

FusionAP will use the capital for engineering and process integration, R&D, IP development, and pilot production capacity. The company is also eligible for a matching research grant from the Malaysia Science Endowment initiative under the Ministry of Science, Technology and Innovation.

Pluang banks Series C funding from MUFG Innovation Partners